What is an LED chip?

So what are its features?The main purpose of LED chip manufacturing is to produce effective and reliable low ohmic contact electrode, and can meet the relatively small pressure drop between the contactable materials and provide the pressure pad for welding line, while as much light as possible.Transfer process generally USES vacuum evaporation method, 4Pa high vacuum, resistance heating or electron beam bombardment heating method to melt the material, and at low pressure BZX79C18 into metal vapor deposition on the surface of the semiconductor material.

In general, the p-type contact metals used include AuBe, AuZn and other alloys, and the contact metals on the n-side usually use AuGeNi alloy.The alloy layer formed after coating also needs to expose the luminous area as much as possible through the lithography process, so that the remaining alloy layer can meet the requirements of effective and reliable low ohm contact electrode and welding line pressure pad.After the photolithography process is completed, the alloying process is carried out, usually under the protection of H2 or N2.The time and temperature of alloying are usually determined by the characteristics of semiconductor materials and the type of alloy furnace.Of course, if the blue and green chip electrode process is also complex, need to increase the passivation film growth, plasma etching process.